Wen Yi Technology: "Hefei State-owned Assets Entering the Company" is currently in the approval process of the competent state-owned assets department.
Golden data on December 4th, Wenyi Technology stated at the performance briefing that, it is understood that up to now, the 'Hefei State-owned Assets Acquisition Company' equity change is currently in the approval process of the competent state-owned assets department, and there is still uncertainty about whether the matter can be finally implemented and completed. Regarding the subsequent matters involved in this equity change, the company will fulfill its disclosure obligations in a timely manner according to the progress, and investors are requested to follow relevant announcements and pay attention to investment risks. The first phase of the company's fan-out wafer-level packaging equipment has been successfully developed, that is, the first manual prototype has been successfully developed. There are many difficulties to be solved and uncertainties in the subsequent research and development, mainly limited by uncertain technical and market factors.
View Original
This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.
Wen Yi Technology: "Hefei State-owned Assets Entering the Company" is currently in the approval process of the competent state-owned assets department.
Golden data on December 4th, Wenyi Technology stated at the performance briefing that, it is understood that up to now, the 'Hefei State-owned Assets Acquisition Company' equity change is currently in the approval process of the competent state-owned assets department, and there is still uncertainty about whether the matter can be finally implemented and completed. Regarding the subsequent matters involved in this equity change, the company will fulfill its disclosure obligations in a timely manner according to the progress, and investors are requested to follow relevant announcements and pay attention to investment risks. The first phase of the company's fan-out wafer-level packaging equipment has been successfully developed, that is, the first manual prototype has been successfully developed. There are many difficulties to be solved and uncertainties in the subsequent research and development, mainly limited by uncertain technical and market factors.