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Copper Crown Copper Foil: HVLP copper foil has entered the supply chain of multiple leading CCL manufacturers with full orders.
Jin10 Data, July 17 news, Tongguan Copper Foil announced an investor relations activity record stating that HVLP copper foil, also known as ultra-low profile copper foil, has an extremely low surface roughness, excellent signal transmission performance, low loss characteristics, and extremely high stability. It is a specialized core material for ultra-low loss high-frequency and high-speed circuit boards, and can be widely used in 5G communication and AI fields. Currently, this product has successfully entered the supply chain of several leading CCL manufacturers, with full orders. The company has the production capacity for 1st to 4th generation HVLP copper foil, and is currently mainly shipping the 2nd generation products.